We present data on the filament size and temperature distribution in Hf0.82Al0.18Ox-based Resistive Random Access Memory (RRAM) devices obtained by transient thermometry and high-resolution transmission electron microscopy (HRTEM). The thermometry shows that the temperature of the nonvolatile conducting filament can reach temperatures as high as 1600 K at the onset of RESET at voltage of 0.8 V and power of 40 μW. The size of the filament was estimated at about 1 nm in diameter. Hot filament increases the temperature of the surrounding high resistivity oxide, causing it to conduct and carry a significant fraction of the total current. The current spreading results in slowing down the filament temperature increase at higher power. The results of thermometry have been corroborated by HRTEM analysis of the as-fabricated and switched RRAM devices. The functional HfAlOx layer in as-fabricated devices is amorphous. In devices that were switched, we detected a small crystalline region of 10–15 nm in size. The crystallization temperature of the HfAlOx was determined to be 850 K in an independent annealing experiment. The size of the crystalline region agrees with thermal modeling based on the thermometry data. Scanning transmission electron microscopy (TEM) coordinated with electron energy loss spectroscopy could not detect changes in the chemical makeup of the filament.Keywords: filament; HRTEM; RRAM; STEM-EELS; thermometry

DC and pulse voltage-induced metal–insulator transition (MIT) in epitaxial VO2 two terminal devices were measured at various stage temperatures. The power needed to switch the device to the ON-state decrease linearly with increasing stage temperature, which can be explained by the Joule heating effect. During transient voltage induced MIT measurement, the incubation time varied across 6 orders of magnitude. Both DC I–V characteristic and incubation times calculated from the electrothermal simulations show good agreement with measured values, indicating Joule heating effect is the cause of MIT with no evidence of electronic effects. The width of the metallic filament in the ON-state of the device was extracted and simulated within the thermal model.

•Threading Edge dislocation segments glide after basal plane dislocation conversion.•Dislocation glide direction is along the Burgers vector towards the up-step direction.•Dislocation glide is applicable for all converted screw basal plane dislocations.•The glide can move the dislocation conversion point below the interface.•The glide could present a mechanism to eliminate basal plane dislocations in epilayers.Transmission electron microscopy (TEM) and KOH etching were used to analyze the motion of dislocations after the conversion of basal plane dislocations (BPDs) to threading edge dislocations (TEDs) during 4H–SiC epitaxy. The locations of TED etch pits on the epilayer surface were shifted compared to the original locations of BPD etch pits on the substrate surface. The shift of the TED etch pits was mostly along the BPD line directions towards the up-step direction. For converted screw type BPDs, the conversion points were located below the substrate/epilayer interface. The shift distances in the step-flow direction were proportional to the depths of the BPD–TED conversion points below the substrate/epilayer interface. For converted mixed type BPDs, the conversion points were exactly at the interface. Through TEM analysis, it was concluded that the dislocation shift is caused by a combined effect of H2 etching prior to growth and glide of the threading segments during high temperature epitaxy. The TED glide is only possible for converted pure screw type BPDs and could present a viable means for eliminating BPDs from the epilayer during growth by moving the conversion point below the substrate/epilayer interface.