Wei He

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Organization: University of Electronic Science and Technology of China
Department: State key Laboratory of Electronic Thin Films and Integrated Devices
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Co-reporter:Jing Xiang, Chong Wang, Yuanming Chen, Shouxu Wang, Yan Hong, Huaiwu Zhang, Lijun Gong, Wei He
Applied Surface Science 2017 Volume 411(Volume 411) pp:
Publication Date(Web):31 July 2017
DOI:10.1016/j.apsusc.2017.02.223
•Air atmosphere plasmacould generatehydrophilic groups of photo-resistive film.•Better wettability of photo-resistive filmled tohigher plating uniformity of copper pillars.•New flow isreduced cost, simplified process and elevated productivity.The wettability of the photo-resistive film (PF) surfaces undergoing different pretreatments including the O2CF4 low-pressure plasma (OCLP) and air plasma (AP), is investigated by water contact angle measurement instrument (WCAMI) before the bottom-up copper pillar plating. Chemical groups analysis performed by attenuated total reflectance Fourier transform infrared spectroscopy (ATR-FTIR) and X-ray photoelectron spectra (XPS) shows that after the OCLP and wash treatment, the wettability of PF surface is attenuated, because embedded fluorine and decreased oxygen content both enhance hydrophobicity. Compared with OCLP treatment, the PF surface treatment by non-toxic air plasma displays features of CO, OCO, CO and NO2 by AIR-FTIR and XPS, and a promoted wettability by WCAM. Under the identical electroplating condition, the surface with a better wettability allows electrolyte to spontaneously soak all the places of vias, resulting in improved copper pillar uniformity. Statistical analysis of metallographic data shows that more coplanar and flat copper pillars are achieved with the PF treatment of air plasma. Such modified copper-pillar-plating technology meets the requirement of accurate impedance, the high density interconnection for IC substrates.Download high-res image (116KB)Download full-size image
Co-reporter:Jianhui Lin, Chong Wang, Shouxu Wang, Yuanming Chen, Wei He, Tan Ze, Bei Chen
Journal of Alloys and Compounds 2017 Volume 719(Volume 719) pp:
Publication Date(Web):30 September 2017
DOI:10.1016/j.jallcom.2017.05.194
•NiZnP electrode full of cracks is prepared by electroless and etching of H2SO4.•The prepared electrode can afford 10 mA cm−2 at 50 mV with no loss in activity for 24 h.•Except for beginning stage, the tafel slope and normalized exchange current is independent of etching time.•The high activity is mainly due to high surface area.In this paper, a rimose NiZnP electrode was prepared by electroless and H2SO4 etching. This electrode acts as an efficient and stable catalytic cathode for water splitting, affording 10 mA cm−2 at an overpotential of 50 mV. It is found that using H2SO4 as an etching reagent is favorable for the formation of Ni(OH)2, and can obtain higher eletrocatalytic activity than using NaOH. It is, moreover, verified that the kinetic parameters do not vary with etching time except for the beginning stage through the study of Tafel slopes and normalized exchange current density. At last the analysis of electrochemically surface area proves that the high catalytic activity for hydrogen evolution is owing to the high surface area.
Co-reporter:Yuanming Chen;Xing Gao;Jinling Wang;Vadim V. Silberschmidt;Shouxu Wang;Zhihua Tao;Huan Xu
Journal of Applied Polymer Science 2015 Volume 132( Issue 16) pp:
Publication Date(Web):
DOI:10.1002/app.41889

ABSTRACT

Ball milling was used to decrease the particle size of boron nitride (BN) nanoplates and to form more silylated functionalization of their surface. Such functionalized BN nanoplates enhanced their homogeneous dispersion in polyimide (PI) matrix. Thermal conductivities, thermal stabilities, and dielectric properties were characterized to investigate the particular effects on the performance of PI-based composites with functionalized BN nanoplates. When the concentration of functionalized BN nanoplates increased to 50 wt %, thermal conductivity of the composite increased up to 1.583 W m−1 K−1, and the temperature of final thermal decomposition was improved to 600°C. An increasing trend was found in the dielectric constant of the composites while the dielectric loss decreased with the increase in the fraction. An appropriate fraction of functionalized BN nanoplates in PI-based composites were necessary to meet the requirement of withstanding drilling forces for the interconnecting through holes of flexible circuits. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015, 132, 41889.

Co-reporter:Yao Tang, Wei He, Shouxu Wang, Zhihua Tao and Lijuan Cheng  
CrystEngComm 2014 vol. 16(Issue 21) pp:4431-4440
Publication Date(Web):28 Feb 2014
DOI:10.1039/C3CE42439A
For the better application of room-temperature sintering in printed electronics, a low-cost and convenient approach to synthesize size-controlled silver nanoparticles (Ag NPs) ca. 37 nm in average diameter is presented. Monodisperse Ag NPs with a narrow size distribution were rapidly and routinely produced on relatively large scales through a typical polyol process using poly(vinyl pyrrolidone) (PVP) as the capping agent and poly(ethylene glycol) (PEG) to enhance the reducibility and viscosity of solvent. These Ag NPs would suffer a spontaneous sintering, which was triggered by the desorption of PVP from their surface, when they encountered a certain amount of Cl−; the eventual coalescence and Ostwald ripening processes would make their structure more compact and solid, leading to a high conductivity even up to 40% that of bulk silver.
Co-reporter:Yuanming Chen;Guoyun Zhou;Yongsuan Hu;Shouxu Wang;Zhihua Tao
Polymer International 2014 Volume 63( Issue 3) pp:546-551
Publication Date(Web):
DOI:10.1002/pi.4556

Abstract

Particulate-filled polyarylene ether nitrile (PEN) composites were prepared using methyltriethoxy-silane-treated aluminium nitride (AlN) as the filler for thermal modification. The effects of AlN fraction, particle size and surface treatment on the thermal performance of PEN were investigated. The thermal conductivities of the composites increased when the AlN filler concentration was increased, as well as with decrement of the filler size. The thermal conductivity value of the composites increased up to 0.779 W m−1 K−1 when the AlN weight loading was 60 wt%. The trend of the thermal conductivities of the composites can be more efficiently predicted by theoretical models than empirical models. The composites exhibited stable performances of thermal decomposition and thermal expansion when AlN filler faction in the composites increased. © 2013 Society of Chemical Industry

Co-reporter:Yao Tang;Shouxu Wang;Zhihua Tao
Journal of Materials Science: Materials in Electronics 2014 Volume 25( Issue 7) pp:2929-2933
Publication Date(Web):2014 July
DOI:10.1007/s10854-014-1961-8
For mass preparation of conductive silver paste, a convenient approach to synthesize silver nanowires (Ag NWs) is presented. Monodisperse Ag NWs with ca. 40 nm in diameter and over 10 μm in length were successfully obtained in high yield only by heating a mixture of AgNO3, poly(vinyl pyrrolidone), ethylene glycol and HCl prepared previously. This method not only simplifies the conventional polyol process but also extremely improves its repeatability. More important, the patterns fabricated with the Ag NWs naturally have a high conductivity, up to ca. 13 % of bulk silver, due to the cross-linked network structure formed by accumulation of nanowires. The conductivity even can be improved to 41 % of bulk silver conductivity through a chemical sintering at room temperature, which makes us believe that the Ag NWs could be broadly applied in preparation of conductive paste.
Co-reporter:Yuanming Chen, Wei He, Xianming Chen, Chong Wang, Zhihua Tao, Shouxu Wang, Guoyun Zhou, Mohamed Moshrefi-Torbati
Electrochimica Acta 2014 120() pp: 293-301
Publication Date(Web):
DOI:10.1016/j.electacta.2013.12.112
Co-reporter:Zhihua Tao, Wei He, Shouxu Wang, and Guoyun Zhou
Industrial & Engineering Chemistry Research 2013 Volume 52(Issue 50) pp:17891
Publication Date(Web):November 21, 2013
DOI:10.1021/ie402693d
Cyproconazole (CPA) is an azole fungicide and easily biodegradable so that it is an alternative corrosion inhibitor in the water treatment and industrial pickling process. Effects of CPA on the corrosion resistance of copper in 0.5 M H2SO4 solutions were evaluated via electrochemical impedance spectroscopy (EIS), potentiodynamic polarization, and scanning electron microscopy (SEM). Both thermodynamic and adsorption models were calculated and discussed. The results showed that the adsorption of CPA on the copper surface obeys the Dhar–Flory–Huggins and Bockris–Swinkels substitutional adsorption isotherms. The number of water molecules (X) replaced by a molecule of organic adsorbate was determined from the different substitutional adsorption isotherms applied to the data obtained from EIS experiments.
Co-reporter:Guoyun Zhou, Wei He, Shouxu Wang, Chia-yun Chen, Ching Ping Wong
Materials Letters 2013 Volume 108() pp:75-78
Publication Date(Web):1 October 2013
DOI:10.1016/j.matlet.2013.06.087
•A porous Ni–P alloy thin-film was electrolessly deposited with addition of MnSO4·H2O in its electrolyte solution to fabricate embedded resistor.•High density of pores or holes were formed in Ni–P thin-film.•Sheet resistance of porous thin-film quadratically increases as the concentration of MnSO4H2O increases.•Resistance tolerance of porous thin-film was lower than 15%.A novel porous Ni–P alloy thin-film was developed to fabricate embedded resistor through the electroless deposition by introducing manganese ion in electrolyte solutions. SEM images demonstrated high density of pores or holes with diameters ranging from 0.1 μm to 3.0 μm was formed in Ni–P thin-film when the concentrations of MnSO4·H2O changed from 0 to 50 g/dm3. Resistance testing results revealed a significant increasing of resistance as the concentration of MnSO4·H2O increases and thereby a quadratical relationship between them was primly fitted with low deviation of 5.75%. Moreover, to explore the application practice of this porous thin-film in embedded resistor, distribution experiment was designed to investigate resistance tolerance using maximum deviation method. Tolerances under 15% indicated this porous Ni–P thin-film is a very practical candidate to fabricate embedded resistors.
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